PowerSAC and the Microelectronics Research Institute have signed a memorandum of understanding to establish long-term collaboration on power semiconductor process technology, advanced packaging, reliability testing and talent development.
Areas of collaboration
- Sharing process and test resources to shorten prototype cycles
- Jointly building pilot-line and validation capabilities for industry
- Co-organising training programmes for power semiconductor engineers
Both parties noted that Hong Kong combines world-class university research with an increasingly complete microelectronics ecosystem, creating a strong foundation from R&D to volume production in wide-bandgap power devices.